●特征  FEATURES

小尺寸，可表面贴装。 铁氧体材料具有大电感量。 单面封装，较普通系列厚度更薄。 工作温度范围-40°C 至+85°C

Small chip suitable for surface mounting. Large inductance with ferrite material. Single-sided package,thinner than normal Series. Operating temperature range -40℃ to +85℃

●用途 Applications

移动电话等电子设备、蓝牙模块、TWS 耳机。

Mobile phones and other electronic devices. Bluetooth modules and TWS earphones.

●结构及尺寸 ●Structure And Dimension